Infineon Technologies AG announced the availability of its new generation 3G platform family. This new platform family addresses all major 3G market segments and includes a high performance HSPA modem solution, a feature phone solution enriched with high multimedia capabilities and a cost-efficient 3G solution.
This platform family is a further step on Infineon’s integration roadmap: it reduces the number of devices in the chipset from three to two and the component count of a typical platform by 50 per cent.
The new 3G-solutions offer the industry’s smallest PCB (printed circuit board) footprint with a space reduction of up to 40 per cent. Furthermore the standby power is reduced by up to 30 per cent compared to existing HSDPA platform solutions.
“Our new platforms enable our customers to fully reuse their hardware and software developments and launch multiple phones covering all feature phone market segments with lower cost and faster time-to-market,” said Prof. Dr. Hermann Eul, Executive Vice President of the Infineon Management Board and President of the Communication Solutions Business Group.
“Given the compelling size of our new Baseband and RF devices and the low component count of our platforms, we are offering the world’s smallest platform footprint, enabling manufacturers to build slim, feature rich HSUPA / HSDPA phones for all 3G market segments.”
Infineon uses its own dual-mode 3GPP release 6 Protocol Stack, which enables the company to provide complete in-house system solutions. Having the ownership of each and every platform component eases completing lab tests (GCF, PTCRB and IOT), field tests and operator approvals on Infineon’s reference platforms, which in turn accelerates customers’ phone projects substantially.
Continue reading Infineon New 3G Chips Available 2nd Half 2008.
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